Substrates with interdigitated hinged edge interconnects
US10182498B2 · kind B2 · utility
0Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2016 |
| Grant date | Jan 15, 2019 |
| Priority date | — |
| Expiry date | Oct 17, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/5385
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A quilt packaging system includes a first microchip substrate having a first edge surface which includes a first conductive interconnecting structure disposed thereon and a second microchip substrate having a first edge surface which includes a second conductive interconnecting structure disposed thereon. The first conductive interconnecting structure is hingedly connected in an interdigitated manner with the second conductive interconnecting structure at an angle that is not a straight angle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.