Tian Lu
13Patents
2h-index
12Co-inventors
43Inventor score
Filing activity: Mar 8, 2012 → Feb 19, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10409004B2 | Method and system to passively align and attach fiber array to laser array or optical waveguide array | Physics | 6 | Active |
| US10598861B2 | Method and system to passively align and attach fiber array to laser array or optical waveguide array | Physics | 3 | Active |
| US9806030B2 | Prototyping of electronic circuits with edge interconnects | Electricity | 1 | Active |
| US9727653B2 | System and method for identifying and ranking user preferences | Physics | 1 | Active |
| US11488660B2 | Adiabatic flip-flop and memory cell design | Electricity | 0 | Active |
| US10945335B2 | Assembling and handling edge interconnect packaging system | Emerging Cross-Sectional Technologies | 0 | Active |
| US9844139B2 | Method of interconnecting microchips | Emerging Cross-Sectional Technologies | 0 | Active |
| US10182498B2 | Substrates with interdigitated hinged edge interconnects | Electricity | 0 | Active |
| US11224126B2 | Edge interconnects for use with circuit boards and integrated circuits | Electricity | 0 | Active |
| US10056335B2 | Prototyping of electronic circuits with edge interconnects | Electricity | 0 | Active |
| US10896898B2 | Edge interconnect self-assembly substrate | Electricity | 0 | Active |
| US11523511B2 | Assembling and handling edge interconnect packaging system | Emerging Cross-Sectional Technologies | 0 | Active |
| US11398463B2 | Edge interconnect self-assembly substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.