Patent · US Active

Probe card and method for producing a probe card

US10184978B2 · kind B2 · utility

0Cited by

3References

21Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Karl Dominizi · Linz, AT
Oliver Frank · Hannover, DE
Klaus Standner · Villach, AT
Stefan Zielke · Linz, AT

Key dates

Filing date	Dec 16, 2014
Grant date	Jan 22, 2019
Priority date	—
Expiry date	Nov 3, 2035

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/2889
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A probe card for a wafer tester includes a mother card having a reinforcing element and at least one daughter card which is rigidly connected to the reinforcing element detachably. The mother card includes electrical contacts for producing an electrical connection with the wafer tester. The at least one daughter card includes electrical contact elements for making contact with an electrical circuit on a wafer. In addition, the mother card and the at least one daughter card are electrically detachably connected to one another via an electrical interface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.