Multi-layer plasma resistant coating by atomic layer deposition

US10186400B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Xiaowei Wu · Beijing, CN
• David Fenwick · Chelmsford, US
• Jennifer Y. Sun · Mountain View, US
• Guodong Zhan · Spring, US

Key dates

• Filing date: Jan 20, 2017
• Grant date: Jan 22, 2019
• Expiry date: Jan 20, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67069
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Described herein are articles, systems and methods where a plasma resistant coating is deposited onto a surface of a chamber component using an atomic layer deposition (ALD) process. The plasma resistant coating has a stress relief layer and a rare earth metal-containing oxide layer and uniformly covers features, such as those having an aspect ratio of about 3:1 to about 300:1.