Patent · US Active

Wafer releasing

US10186445B2 · kind B2 · utility

0Cited by

3References

19Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Mathias Male · Lienz, AT
Christian Maier · Kettenham, DE
Philemon Schweizer · Feffernitz, AT
Manfred Bucher · Villach, AT
Thomas Steiner · Burnaby, CA

Key dates

Filing date	Jul 13, 2016
Grant date	Jan 22, 2019
Priority date	—
Expiry date	Mar 2, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH02N13/00
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments of the present invention provide a chuck system for handling a wafer that comprises a first and a second main surface. The chuck system includes a chuck configured to hold the wafer at the second main surface facing the chuck and a release device. The chuck system further includes an actuator configured to lift the release device away from the chuck. The release device is configured such that the release device mechanically engages with the wafer at an edge portion of the second main surface of the wafer when being lifted, thereby releasing the wafer from the chuck.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.