Electronic device comprising an encapsulating block locally of smaller thickness
US10186466B2 · kind B2 · utility
0Cited by
2References
4Claims
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Assignee
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Key dates
| Filing date | Oct 10, 2017 |
| Grant date | Jan 22, 2019 |
| Priority date | — |
| Expiry date | Nov 3, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a carrier substrate with at least one integrated-circuit chip mounted on a front face of the carrier substrate. An encapsulation block on the front face and embedding the integrated-circuit chip has a periphery with corners. The encapsulating block further has, in at least one local zone located in at least one corner and from the front face of the carrier substrate, a smaller thickness than a thickness of the encapsulation block at least in a surrounding zone. The electronic device is manufactured by a process in which the zone of smaller thickness is obtained by molding or by machining.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.