Luc Petit
7Patents
4h-index
7Co-inventors
50Inventor score
Filing activity: Jun 13, 1997 → Oct 10, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6049971A | Casing for integrated circuit chips and method of fabrication | Emerging Cross-Sectional Technologies | 20 | Expired |
| US6399475B1 | Process for producing electrical connections on the surface of a semiconductor package with electrical-connection drops | Emerging Cross-Sectional Technologies | 13 | Expired |
| US5959355A | Semiconductor package having mechanically and electrically bonded supportive elements | Emerging Cross-Sectional Technologies | 9 | Expired |
| US9818664B2 | Electronic device comprising an encapsulating block locally of smaller thickness | Electricity | 5 | Active |
| US9006904B2 | Dual side package on package | Electricity | 1 | Active |
| US6528407B1 | Process for producing electrical-connections on a semiconductor package, and semiconductor package | Emerging Cross-Sectional Technologies | 1 | Expired |
| US10186466B2 | Electronic device comprising an encapsulating block locally of smaller thickness | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.