Process substrate with crystal orientation mark, method of detecting crystal orientation, and reading device of crystal orientation mark
US10186489B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2014 |
| Grant date | Jan 22, 2019 |
| Priority date | — |
| Expiry date | Jul 12, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To provide a crystal orientation mark which can be formed easily and inexpensively, and which enables to perform high precision alignment and allows information other than crystal orientation to be included, even for a small diameter process substrate. A crystal orientation mark is drawn on the surface of the process substrate. The crystal orientation mark includes a marking region for crystal orientation detection, and a marking region for information. The marking region for crystal orientation detection is provided at two locations in an outer edge portion of the process substrate to be used for the alignment of the process substrate. The marking region for information is provided on a straight-line region connecting the marking regions for crystal orientation detection at the two locations, and includes a pattern for demonstrating predetermined information relating to the process substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.