Self-aligned floating mirror for contact vias
US10186644B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2015 |
| Grant date | Jan 22, 2019 |
| Priority date | — |
| Expiry date | Sep 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Described herein are LED chips incorporating self-aligned floating mirror layers that can be configured with contact vias. These mirror layers can be utilized to reduce dim areas seen around the contact vias due to underlying material layers without the need for the mirror layer to be designed at some tolerance distance from the electrical via. This increases mirror area, eliminating lower light reflection in the proximity of the via and producing higher light output with greater light emission uniformity. In some embodiments, the mirror layer is formed with a contact via. This allows for a self-aligning process and results in the mirror layer extending substantially from the edge of the via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.