MEMS piezoelectric device and corresponding manufacturing process
US10186654B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2016 |
| Grant date | Jan 22, 2019 |
| Priority date | — |
| Expiry date | Mar 15, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/88
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A MEMS piezoelectric device includes a monolithic semiconductor body having first and second main surfaces extending parallel to a horizontal plane formed by first and second horizontal axes. A housing cavity is arranged within the monolithic semiconductor body. A membrane is suspended above the housing cavity at the first main surface. A piezoelectric material layer is arranged above a first surface of the membrane with a proof mass coupled to a second surface, opposite to the first surface, along the vertical axis. An electrode arrangement is provided in contact with the piezoelectric material layer. The proof mass causes deformation of the piezoelectric material layer in response to environmental mechanical vibrations. The proof mass is coupled to the membrane by a connection element arranged, in a central position, between the membrane and the proof mass in the direction of the vertical axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.