Semiconductor device package and method of manufacturing the same
US10186779B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2016 |
| Grant date | Jan 22, 2019 |
| Priority date | — |
| Expiry date | Jul 14, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various embodiments of the present disclosure relate to a semiconductor device package including a carrier, an electrical component, an antenna, a conductive pad and a conductive line. The carrier includes a top surface. The electrical component is disposed over the top surface of the carrier. The antenna is disposed over the top surface of the carrier and spaced away from the electrical component. The conductive pad is disposed over the top surface of the carrier and beneath the antenna, wherein the conductive pad includes a resonant structure. The conductive line is electrically connected to the electrical component and extends within the carrier. A part of the conductive line is beneath the antenna and the resonant structure of the conductive pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.