Interconnect assembly with flexible circuit
US10187987B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2017 |
| Grant date | Jan 22, 2019 |
| Priority date | — |
| Expiry date | Sep 17, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2036
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interconnect assembly includes a spacer assembly including a top surface and a bottom surface; and a flexible circuit member including a first surface and a second surface opposite the first surface. The flexible circuit member curves about at least a portion of the spacer assembly such that a first portion of the first surface of the flexible circuit member is coupled to the top surface of the spacer assembly and a second portion of the first surface of the flexible circuit member is coupled to the bottom surface of the spacer assembly. The interconnect assembly further includes at least one top electrical interface element coupled to a first portion of the second surface of the flexible circuit member; and at least one bottom electrical interface element coupled to a second portion of the second surface of the flexible circuit member. The first portion of the second surface of the flexible circuit member is spaced apart from the second portion of the second surface of the flexible circuit member. The at least one top electrical interface element, the flexible circuit member, and the at least one bottom electrical interface element form an electrical signal path between the at …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.