Bret W. Simon
12Patents
1h-index
16Co-inventors
47Inventor score
Filing activity: Mar 29, 2013 → May 3, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9589913B1 | Flip chip stacking utilizing interposer | Electricity | 2 | Active |
| US10799211B2 | Sterile covers for ultrasound probe | Human Necessities | 1 | Active |
| US11950955B2 | Sterile covers for ultrasound probe | Human Necessities | 0 | Active |
| US11502060B2 | Microelectronics package with enhanced thermal dissipation | Electricity | 0 | Active |
| US11326246B2 | Controlled warping of shadow mask tooling for improved reliability and miniturization via thin film deposition | Performing Operations; Transporting | 0 | Active |
| US11637211B2 | Optically clear thermal spreader for status indication within an electronics package | Electricity | 0 | Active |
| US11621219B2 | Method and apparatus for through silicon die level interconnect | Electricity | 0 | Active |
| US11276641B1 | Conformal multi-plane material deposition | Electricity | 0 | Active |
| US11948855B1 | Integrated circuit (IC) package with cantilever multi-chip module (MCM) heat spreader | Electricity | 0 | Active |
| US10187987B1 | Interconnect assembly with flexible circuit | Electricity | 0 | Active |
| US11515225B2 | Reconstituted wafer including mold material with recessed conductive feature | Electricity | 0 | Active |
| US11605570B2 | Reconstituted wafer including integrated circuit die mechanically interlocked with mold material | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.