Method for forming micropattern of polyimide using imprinting
US10189203B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2014 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | Mar 28, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2079/08
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Provided is a method for forming a pattern of polyimide that is simpler and is more excellent in the pattern shape and in the dimensional accuracy in comparison with the conventional techniques of patterning polyimide, such as photolithography and laser processing. In a method for forming a micropattern of polyimide, which includes using as polyimide a solvent-soluble polyimide resin composition that is photosensitive and is moldable at a temperature of less than or equal to a glass-transition temperature; patterning the composition using thermal imprinting; and thermally curing the composition, ultraviolet irradiation is performed after the composition is released from a mold after a molding step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.