Hideki Takagi
20Patents
6h-index
68Co-inventors
72Inventor score
Filing activity: Nov 24, 1993 → Mar 24, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8099982B2 | Method of molding glass parts and molding apparatus | Emerging Cross-Sectional Technologies | 49 | Active |
| US6280802A | Method of forming film of ultrafine particles | Chemistry; Metallurgy | 41 | Expired |
| US7331092B2 | Method and manufacturing surface acoustic wave device | Emerging Cross-Sectional Technologies | 27 | Expired |
| US5396039A | Process for assembling piping or components by TIG welding | Performing Operations; Transporting | 19 | Expired |
| US7040963B1 | Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer | Performing Operations; Transporting | 11 | Expired |
| US9349918B2 | Light emitting element and method for manufacturing same | Electricity | 7 | Active |
| US9751754B2 | Package formation method and MEMS package | Performing Operations; Transporting | 5 | Active |
| US9929311B2 | Semiconductor light emitting element and method for producing the same | Electricity | 4 | Active |
| US7378728B2 | Electronic component mounting package and package assembled substrate | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6509633B1 | IC package capable of accommodating discrete devices | Electricity | 3 | Expired |
| US9761479B2 | Manufacturing method for semiconductor substrate | Electricity | 2 | Active |
| US10189203B2 | Method for forming micropattern of polyimide using imprinting | Performing Operations; Transporting | 2 | Active |
| US8936998B2 | Manufcaturing method for room-temperature substrate bonding | Electricity | 2 | Active |
| US8602289B2 | Room temperature bonding using sputtering | Performing Operations; Transporting | 0 | Active |
| US8608048B2 | Room-temperature bonding method and room-temperature bonding apparatus including sputtering | Performing Operations; Transporting | 0 | Active |
| US12027440B2 | Composite having diamond crystal base | Electricity | 0 | Active |
| US12389520B2 | Plasma source, and atomic clock employing plasma source | Electricity | 0 | Active |
| US10112376B2 | Device manufactured by room-temperature bonding, device manufacturing method, and room-temperature bonding apparatus | Emerging Cross-Sectional Technologies | 0 | Active |
| US9580306B2 | Room temperature bonding apparatus and room temperature bonding method | Electricity | 0 | Active |
| US9112035B2 | Semiconductor substrate, field-effect transistor, integrated circuit, and method for fabricating semiconductor substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.