Polyimide-based polymer thick film compositions
US10189950B2 · kind B2 · utility
1Cited by
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10Claims
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Assignee
Inventors
Key dates
| Filing date | Dec 12, 2016 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | Feb 28, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0323
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention is directed to polyimide-based polymer thick film compositions and particularly non-fluorinated polyimide-based polymer thick film compositions. These compositions are comprised of certain polyimide polymers and certain solvents. In some embodiments various functional components are added to the composition to provide compositions that can be used to form various elements of an electrical circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.