Thermally conductive interface composition and use thereof
US10190031B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 6, 2016 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | Nov 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermally conductive interface composition is interposed between a heat generating component and a heat dissipating component. To meet escalated heat dissipation for performance demanding devices, a thermally conductive interface composition comprises (A) A linear alkenyl organopolysiloxane containing a silicon-bonded alkenyl-terminated group or groups, (B) A branched alkenyl organopolysiloxane containing at least two silicon-bonded alkenyl groups, (C) thermally conductive fillers in a ternary particle size mixture, (D) An organohydrogenpolysiloxane containing at least two Si—H terminated groups, (E) An addition reaction catalyst, (F) A hydroxy group-containing siloxane, (G) Alkoxy group-containing siloxanes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.