Jiali Wu
11Patents
3h-index
14Co-inventors
57Inventor score
Filing activity: Jun 17, 1999 → Nov 27, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6380322B1 | Reworkable high temperature adhesives | Chemistry; Metallurgy | 12 | Expired |
| US8492199B2 | Reworkable underfills for ceramic MCM C4 protection | Electricity | 6 | Active |
| US6989433B2 | Low stress conformal coatings of reliability without hermeticity for microelectromechanical system based multichip module encapsulation | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7808099B2 | Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method | Chemistry; Metallurgy | 2 | Active |
| US7537487B2 | Crosstalk reduction in dual inline memory module (DIMM) connectors | Emerging Cross-Sectional Technologies | 2 | Active |
| US7407415B2 | Crosstalk reduction in dual inline memory module (DIMM) connectors | Emerging Cross-Sectional Technologies | 2 | Active |
| USD1067490S1 | Solar landscape light | General | 0 | Active |
| US9157019B2 | Thermal conductivity improved composition with addition of nano particles used for interface materials | Emerging Cross-Sectional Technologies | 0 | Active |
| US7932342B2 | Method to improve wettability by reducing liquid polymer macromolecule mobility through forming polymer blend system | Chemistry; Metallurgy | 0 | Active |
| US9490142B2 | Cu-low K cleaning and protection compositions | Chemistry; Metallurgy | 0 | Active |
| US10190031B2 | Thermally conductive interface composition and use thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.