Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features

US10190228B2 · kind B2 · utility

Assignee

• Rohm and Haas Electronic Materials LLC · US

Inventors

• Matthew Thorseth · Westminster, US
• Rebecca Hazebrouck · Salem, US
• Mark Scalisi · Salem, US
• Zuhra I. Niazimbetova · Westborough, US
• Joanna Dziewiszek · Boxborough, US

Key dates

• Filing date: Mar 7, 2017
• Grant date: Jan 29, 2019
• Expiry date: Mar 7, 2037

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D7/123
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Copper electroplating baths and methods enable the plating of photoresist defined megafeatures at high current densities which have substantially uniform morphology and reduced nodule development. The copper electroplating baths include a mixture of heterocyclic nitrogen containing copolymers which provide megafeatures having a good % TIR and % WID balance.