Mark Scalisi
4Patents
0h-index
10Co-inventors
28Inventor score
Filing activity: Jun 30, 2014 → Jun 13, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10988852B2 | Method of electroplating copper into a via on a substrate from an acid copper electroplating bath | Electricity | 0 | Active |
| US10190228B2 | Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features | Chemistry; Metallurgy | 0 | Active |
| US9809891B2 | Plating method | Electricity | 0 | Active |
| US10508349B2 | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.