Interposer and semiconductor package with noise suppression features
US10192833B2 · kind B2 · utility
0Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2015 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | Dec 20, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19104
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Interposer and semiconductor package embodiments provide for the isolation and suppression of electronic noise such as EM emissions in the semiconductor package. The interposer includes shield structures in various embodiments, the shield structures blocking the electrical noise from the noise source, from other electrical signals or devices. The shields include solid structures and some embodiments and decoupling capacitors in other embodiments. The coupling structures includes multiple rows of solder balls included in strips that couple the components and surround and contain the source of electrical noise.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.