Inventor · Zhudong, TW

Feng-Wei Kuo

186Patents
10h-index
85Co-inventors
79Inventor score

Filing activity: May 11, 2010 → May 1, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US8912581B2 3D transmission lines for semiconductors Electricity 32 Active
US8570082B1 PVT-free calibration circuit for TDC resolution in ADPLL Electricity 32 Active
US9711465B2 Antenna cavity structure for integrated patch antenna in integrated fan-out packaging Electricity 28 Active
US8593189B1 Phase locked loop (PLL) with multi-phase time-to-digital converter (TDC) Electricity 27 Active
US9086452B2 Three-dimensional integrated circuit and method for wireless information access thereof Electricity 25 Active
US8547151B2 Phase-locked loops that share a loop filter Electricity 18 Active
US8456207B1 Lock detector and method of detecting lock status for phase lock loop Electricity 17 Active
US9991216B2 Antenna cavity structure for integrated patch antenna in integrated fan-out packaging Electricity 17 Active
US8621409B2 System and method for reducing layout-dependent effects Physics 15 Active
US8193963B2 Method and system for time to digital conversion with calibration and correction loops Physics 13 Active
US8314652B2 System and method for RC calibration using phase and frequency Electricity 8 Active
US9160351B2 Phase-locked loop circuit Electricity 7 Active
US10866440B1 Optical modulator and package Physics 7 Active
US10153728B2 Semiconductor device and method Electricity 7 Active
US8816735B1 Phase-locked loop circuit Electricity 7 Active
US10460987B2 Semiconductor package device with integrated antenna and manufacturing method thereof Electricity 6 Active
US9385731B2 Phase-locked loop (PLL) Electricity 6 Active
US9275950B2 Bead for 2.5D/3D chip packaging application Electricity 6 Active
US10976489B2 Optical device and method of manufacturing the same Physics 5 Active
US8189158B1 Fringe field switching liquid crystal display apparatus Physics 5 Active
US9219039B2 Interposer and semiconductor package with noise suppression features Electricity 5 Active
US10037897B2 Inter-fan-out wafer level packaging with coaxial TIV for 3D IC low-noise packaging Electricity 5 Active
US8476972B2 Method and apparatus for amplifying a time difference Physics 4 Active
US9319053B2 Phase-locked loop (PLL) Electricity 4 Active
US9190985B2 Electronic device with switched-capacitor tuning and related method Electricity 4 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.