Package for environmental parameter sensors and method for manufacturing a package for environmental parameter sensors
US10192842B2 · kind B2 · utility
2Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2014 |
| Grant date | Jan 29, 2019 |
| Priority date | — |
| Expiry date | Dec 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20645
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A sensor package comprises a sensor chip bonded to an intermediate carrier, with the sensor element over an opening in the carrier. The package is for soldering to a board, during which the intermediate carrier protects the sensor part of the sensor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.