Hendrik Bouman
7Patents
1h-index
10Co-inventors
40Inventor score
Filing activity: Sep 11, 2012 → Apr 12, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10192842B2 | Package for environmental parameter sensors and method for manufacturing a package for environmental parameter sensors | Electricity | 2 | Active |
| US9385099B2 | Die interconnect | Electricity | 1 | Active |
| US9862600B2 | Chip structure | Electricity | 0 | Active |
| US12180066B2 | Sensor package and method of producing the sensor package | Electricity | 0 | Active |
| US11293821B2 | Pressure sensor module | Performing Operations; Transporting | 0 | Active |
| US11001495B2 | Sensor package and method of producing the sensor package | Electricity | 0 | Active |
| US9070695B2 | Integrated circuit with sensor and method of manufacturing such an integrated circuit | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.