Modular multiplexing interface assembly for reducing semiconductor testing index time
US10197622B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 3, 2015 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Apr 19, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2893
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A modular multiplexing interface assembly and corresponding methodology are provided for reducing semiconductor testing index time in automated semiconductor test equipment using robotic handlers. The modular multiplexing interface assembly includes a modular printed circuit multiplexing motherboard that attaches to the automated semiconductor test equipment, and a plurality of modular load boards, each modular load board being detachably connected, electrically and mechanically, to a robotic handler. The modular multiplexing interface assembly also includes a plurality of electrical cable bundles, each electrical cable bundle electrically connecting the printed circuit motherboard with one of the plurality of modular load boards, wherein the plurality of electrical cable bundles are trace-length matched for a designated digital signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.