Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
US10197890B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2016 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Dec 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/806
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.