Resin and photosensitive resin composition
US10197915B2 · kind B2 · utility
1Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2015 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Nov 19, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/13024
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Provided is a resin capable of producing a photosensitive resin composition having high sensitivity and heat resistance. Disclosed is a resin having a structure represented by general formula (1) or (2) as a main component, wherein R2 has an organic group represented by general formula (3) and an organic group represented by general formula (4).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.