Ryoji Okuda
14Patents
3h-index
16Co-inventors
53Inventor score
Filing activity: May 8, 2000 → Aug 30, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6929890B2 | Positive-type photosensitive resin composition | Physics | 20 | Expired |
| US6696112B2 | Display device having a polyimide insulating layer | Chemistry; Metallurgy | 5 | Expired |
| US6723484B1 | Positive-working photosensitive resin precursor composition | Chemistry; Metallurgy | 4 | Expired |
| US7214455B2 | Photosensitive resin composition and process for producing heat-resistant resin film | Electricity | 3 | Expired |
| US10584205B2 | Photosensitive resin composition | Electricity | 2 | Active |
| US11174350B2 | Resin and photosensitive resin composition | Electricity | 1 | Active |
| US10197915B2 | Resin and photosensitive resin composition | Electricity | 1 | Active |
| US11802181B2 | Di-amine compound, and heat-resistant resin and resin composition using the same | Electricity | 0 | Active |
| US10990008B2 | Resin composition | Electricity | 0 | Active |
| US9114501B2 | Polishing pad | Performing Operations; Transporting | 0 | Active |
| US11347146B2 | Resin composition | Electricity | 0 | Active |
| US10365559B2 | Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device | Electricity | 0 | Active |
| US10908500B2 | Cured film and method for producing same | Physics | 0 | Active |
| US10545406B2 | Cured film formed by curing photosensitive resin composition and method for manufacturing same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.