Semiconductor module cooling system

US10199238B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Inpil Yoo · Unterhaching, DE
• Andreas Grassmann · Villach, AT

Key dates

• Filing date: Feb 23, 2018
• Grant date: Feb 5, 2019
• Expiry date: Feb 23, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L23/3107
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A cooling apparatus includes a discrete module and a plastic housing. The discrete module includes a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound and a first cooling plate at least partly uncovered by the mold compound. The plastic housing surrounds the periphery of the discrete module. The plastic housing includes a first singular plastic part which receives the discrete module and a second singular plastic part attached to a periphery of the first plastic part. The second plastic part has a cutout which exposes at least part of the first cooling plate and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of the discrete module at a side of the discrete module with the first cooling plate.