Imprint apparatus, and method of manufacturing article
US10199244B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2015 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Jan 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An imprint apparatus includes a substrate holder including a plurality of chucking regions for chucking a substrate, and a controller that controls chucking forces of the chucking regions. The chucking regions include a first chucking region for chucking a periphery of a first substrate having a first diameter, a second chucking region for chucking a periphery of a second substrate having a second diameter larger than the first diameter, a third chucking region group divided into a plurality of regions inside the first chucking region, and a fourth chucking region group divided into a plurality of regions between the first chucking region and the second chucking region. The controller controls the chucking forces of each of the chucking regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.