Electronic package
US10199317B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2016 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Oct 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/243
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An electronic package includes a circuit structure having a first metal layer, a packaging layer formed on the circuit structure, and a second metal layer formed on the packaging layer and separated from the first metal layer at a distance. The first metal layer and the second metal layer constitute an antenna structure. Since the second metal layer is formed on a portion of a surface of the packaging layer, a propagating wave emitted by the first metal layer cannot pass through the second metal layer, but a surface of the packaging layer not covered by the second metal layer. Therefore, the propagating wave can be transmitted to a predetermined target, and the electronic package performs the function of an antenna.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.