SILICONWARE PRECISION INDUSTRIES CO., LTD.
803Patents
498Active
803Granted
54Portfolio score
Filing activity: Dec 8, 1997 → Jun 3, 2024 · 72 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6384472B1 | Leadless image sensor package structure and method for making the same | Electricity | 348 | Expired |
| US6545332B2 | Image sensor of a quad flat package | Electricity | 345 | Expired |
| US6198171A | Thermally enhanced quad flat non-lead package of semiconductor | Electricity | 288 | Expired |
| US6218731A | Tiny ball grid array package | Electricity | 280 | Expired |
| US6414385B1 | Quad flat non-lead package of semiconductor | Electricity | 277 | Expired |
| US6476469B2 | Quad flat non-leaded package structure for housing CMOS sensor | Electricity | 237 | Expired |
| US6559525B2 | Semiconductor package having heat sink at the outer surface | Electricity | 236 | Expired |
| US6476474B1 | Dual-die package structure and method for fabricating the same | Electricity | 209 | Expired |
| US6507120B2 | Flip chip type quad flat non-leaded package | Electricity | 195 | Expired |
| US6667546B2 | Ball grid array semiconductor package and substrate without power ring or ground ring | Electricity | 187 | Expired |
| US6603196B2 | Leadframe-based semiconductor package for multi-media card | Electricity | 172 | Expired |
| US6828665B2 | Module device of stacked semiconductor packages and method for fabricating the same | Electricity | 163 | Expired |
| US6184573A | Chip packaging | Electricity | 163 | Expired |
| US6472741B1 | Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same | Electricity | 133 | Expired |
| US6525942B2 | Heat dissipation ball grid array package | Electricity | 132 | Expired |
| US6507104B2 | Semiconductor package with embedded heat-dissipating device | Electricity | 127 | Expired |
| US7934313B1 | Package structure fabrication method | Emerging Cross-Sectional Technologies | 125 | Active |
| US6282094A | Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same | Emerging Cross-Sectional Technologies | 117 | Expired |
| US6246115A | Semiconductor package having a heat sink with an exposed surface | Electricity | 108 | Expired |
| US6593662B1 | Stacked-die package structure | Electricity | 105 | Expired |
| US6590281B2 | Crack-preventive semiconductor package | Electricity | 104 | Expired |
| US6388313B1 | Multi-chip module | Electricity | 99 | Expired |
| US6114752A | Semiconductor package having lead frame with an exposed base pad | Electricity | 99 | Expired |
| US6483178B1 | Semiconductor device package structure | Electricity | 97 | Expired |
| US6630729B2 | Low-profile semiconductor package with strengthening structure | Electricity | 96 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.