Microelectronic interposer for a microelectronic package
US10199353B2 · kind B2 · utility
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1References
29Claims
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Assignee
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Key dates
| Filing date | Sep 12, 2016 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Sep 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06572
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic interposer for a microelectronic package may be fabricated, wherein a first microelectronic device within the microelectronic package is in electronic communication with at least one second microelectronic device through the microelectronic interposer which positions the at least one second microelectronic device outside a periphery of the first microelectronic device. The microelectronic interposer may further include at least one recess for achieving a desired height and/or enabling various configurations for the microelectronic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.