Ranjul Balakrishnan
10Patents
1h-index
18Co-inventors
43Inventor score
Filing activity: Sep 12, 2016 → Aug 30, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10177161B2 | Methods of forming package structures for enhanced memory capacity and structures formed thereby | Electricity | 3 | Active |
| US10720407B2 | Microelectronic interposer for a microelectronic package | Electricity | 0 | Active |
| US12426153B2 | Twisted differential compensation for routing high-speed signals near power delivery inductors and system miniaturization | Electricity | 0 | Active |
| US11600544B2 | Chip package with staggered pin pattern | Electricity | 0 | Active |
| US10608311B2 | Cable assembly comprising a single wire coupled to a signal launcher and housed in a first cover portion and in a second ferrite cover portion | Electricity | 0 | Active |
| US10199353B2 | Microelectronic interposer for a microelectronic package | Electricity | 0 | Active |
| US12336088B2 | Inductive coupling structures for reducing cross talk effects in parallel bus technologies | Electricity | 0 | Active |
| US10734393B2 | Methods of forming package structures for enhanced memory capacity and structures formed thereby | Electricity | 0 | Active |
| US12349274B2 | Low profile SODIMM (small outline dual inline memory module) | Electricity | 0 | Active |
| US11363717B2 | Inductor array and support | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.