Communication system having a multi-layer PCB including a dielectric waveguide layer with a core and cladding directly contacting ground planes
US10199706B2 · kind B2 · utility
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7References
17Claims
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Key dates
| Filing date | Oct 21, 2016 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Nov 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0298
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments herein describe a high-speed communication channel in a PCB that includes a dielectric waveguide sandwiched between two ground layers. The dielectric waveguide includes a core and a cladding where the material of the core has a higher dielectric constant than the material of the cladding. Thus, electromagnetic signals propagating in the core are internally reflected at the interface between the core and cladding such that the electromagnetic signals are primary contained in the core.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.