Cooling a heat-generating electronic device
US10199904B2 · kind B2 · utility
3Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2017 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Feb 23, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10416
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system includes a primary Printed Circuit Board (PCB) and a heat transfer device that is attached to the primary PCB. The primary PCB includes a heat generating device and a thermal conductive inlay attached to the heat generating device. The heat transfer device includes a secondary PCB that is thermally coupled to the primary PCB, and a heat dissipation block. The heat dissipation block has a first side attached to the thermal conductive inlay of the primary PCB and a second side attached to the secondary PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.