Polishing pad having grooves on bottom surface of top layer
US10201887B2 · kind B2 · utility
4Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2017 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | May 16, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad is provided. The polishing pad includes a base layer, a top layer, and multiple grooves. The top layer is located over the base layer and has a polishing surface and a bottom surface opposite to each other. The bottom surface is connected to the base layer. The grooves are formed on the bottom surface of the top layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.