Patent · US Active

Method of sputtering and sputter system

US10202682B2 · kind B2 · utility

11Cited by

4References

24Claims

0Family size

Assignee

EVATEC AG · CH

Inventors

Sven Uwe Rieschl · Chur, CH
Juergen Weichart · Balzers, LI

Key dates

Filing date	Mar 31, 2017
Grant date	Feb 12, 2019
Priority date	—
Expiry date	Mar 31, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01J37/3467
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

So as to control the operation of a sputter target during the lifetime of the target and under HIPIMS operation, part of a magnet arrangement associated to the target is retracted from the target whereas a second part II of the magnet arrangement is, if at all, retracted less from the addressed backside during the lifetime of the target. Thereby, part I is closer to the periphery of target than part II, as both are eccentrically rotated about a rotational axis.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.