EVATEC AG
49Patents
49Active
49Granted
54Portfolio score
Filing activity: Dec 12, 2007 → Sep 16, 2022 · 2 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10347515B2 | Method for manufacturing workpieces and apparatus | Emerging Cross-Sectional Technologies | 17 | Active |
| US9355824B2 | Arc suppression and pulsing in high power impulse magnetron sputtering (HIPIMS) | Electricity | 12 | Active |
| US10388559B2 | Apparatus for depositing a layer on a substrate in a processing gas | Electricity | 12 | Active |
| US9478420B2 | Method for depositing a group III nitride semiconductor film | Electricity | 11 | Active |
| US10138553B2 | Vacuum treatment apparatus | Electricity | 11 | Active |
| US9587306B2 | Method for producing a directional layer by cathode sputtering, and device for implementing the method | Electricity | 11 | Active |
| US10202682B2 | Method of sputtering and sputter system | Electricity | 11 | Active |
| US9396981B2 | Vacuum treatment apparatus | Electricity | 11 | Active |
| US9694990B2 | Transport and handing-over arrangement for disc-shaped substrates, vacuum treatment installation and method for manufacture treated substrates | Electricity | 5 | Active |
| US9490166B2 | Apparatus and method for depositing a layer onto a substrate | Electricity | 2 | Active |
| US9624572B2 | Method of HIPIMS sputtering and HIPIMS sputter system | Electricity | 2 | Active |
| US11217434B2 | RF capacitive coupled dual frequency etch reactor | Electricity | 2 | Active |
| US9611537B2 | Target shaping | Electricity | 2 | Active |
| US10403522B2 | Chamber for degassing substrates | Electricity | 1 | Active |
| US10784092B2 | Reactive sputtering with HIPIMs | Electricity | 1 | Active |
| US10580671B2 | Chamber for degassing substrates | Electricity | 1 | Active |
| US9934992B2 | Chamber for degassing substrates | Electricity | 1 | Active |
| US10692707B2 | RF substrate bias with high power impulse magnetron sputtering (HIPIMS) | Electricity | 1 | Active |
| US9627324B2 | Apparatus and method for processing a substrate | Electricity | 1 | Active |
| US10889890B2 | Vacuum processing apparatus and method for vacuum processing substrates | Electricity | 0 | Active |
| US10301125B2 | Transport and handing-over arrangement for disc-shaped substrates, vacuum treatment installation and method for manufacture treated substrates | Electricity | 0 | Active |
| US10224188B2 | RF sputtering arrangement | Electricity | 0 | Active |
| US11469085B2 | Vacuum plasma workpiece treatment apparatus | Electricity | 0 | Active |
| US9593407B2 | Direct liquid deposition | Chemistry; Metallurgy | 0 | Active |
| US9719177B2 | In-situ conditioning for vacuum processing of polymer substrates | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.