Method for producing substrate for semiconductor element mounting
US10204801B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 11, 2014 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Mar 11, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process of forming, on a surface of the substrate a plurality of resist layers made of two kinds of dry film resist that differ in main peak wavelength in spectral photosensitivity. An exposure process of selectively exposing and affecting a particular resist layer in accordance with a first pattern upon using a first exposure mask overlaid on the plurality of resist layers. A second exposure process of exposing another resist layer in accordance with a second pattern upon using a second exposure mask overlaid on the plurality of resist layers. Partially uncovering the surface of the substrate by removing unexposed portions of the plurality of resist layers, to form a resist mask having an aperture. Finally, forming a coat layer by plating a portion of the substrate where the surface thereof is uncovered; and a process of removing the resist mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.