Patent assignee · JP · COMPANY

Ohkuchi Materials Co., Ltd.

18Patents
18Active
18Granted
46Portfolio score

Filing activity: Mar 11, 2014 → Mar 27, 2020

Most-cited patents

PatentTitleAreaCited byStatus
US10903150B2 Lead frame Electricity 3 Active
US10847451B2 Device for mounting semiconductor element, lead frame, and substrate for mounting semiconductor element Electricity 2 Active
US10312187B2 Multi-row wiring member for semiconductor device and method for manufacturing the same Electricity 1 Active
US10304760B2 Lead frame and method for manufacturing the same Electricity 1 Active
US10229871B2 Lead frame Electricity 1 Active
US10777492B1 Substrate for mounting semiconductor element Electricity 1 Active
US10727171B2 Lead frame Electricity 0 Active
US10204801B2 Method for producing substrate for semiconductor element mounting Electricity 0 Active
US10763196B1 Lead frame Electricity 0 Active
US10811346B2 Lead frame Electricity 0 Active
US10886206B2 Lead frame, resin-equipped lead frame, optical semiconductor device, and method for manufacturing lead frame Electricity 0 Active
US10763202B2 Multi-row wiring member for semiconductor device and method for manufacturing the same Electricity 0 Active
US10622286B2 Lead frame and method for manufacturing the same Electricity 0 Active
US10453782B2 Multi-row wiring member for semiconductor device and method for manufacturing the same Electricity 0 Active
US10276422B2 Semiconductor device substrate, semiconductor device wiring member and method for manufacturing them, and method for manufacturing semiconductor device using semiconductor device substrate Electricity 0 Active
US11062983B2 Substrate for mounting semiconductor element Electricity 0 Active
US11404286B2 Lead frame Electricity 0 Active
US10305007B2 Multi-row LED wiring member and method for manufacturing the same Electricity 0 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.