Socket contact techniques and configurations

US10205292B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Dhanya Athreya · Chandler, US
• Gaurav Chawla · Tempe, US
• Kemal Aygun · Tempe, US
• Glen P. Gordon · Graham, US
• Sarah M. Canny · Hillsboro, US
• Jeffory L. Smalley · East Olympia, US
• Srikant Nekkanty · Chandler, US
• Michael Garcia · Mesa, US
• Joshua D. Heppner · Chandler, US

Key dates

• Filing date: Sep 26, 2017
• Grant date: Feb 12, 2019
• Expiry date: Sep 26, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.