Joshua D. Heppner
43Patents
5h-index
73Co-inventors
68Inventor score
Filing activity: Dec 16, 2010 → Jul 8, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8025531B1 | Shielded socket housing | Electricity | 14 | Active |
| US9265170B2 | Integrated circuit connectors | Emerging Cross-Sectional Technologies | 7 | Active |
| US10070520B2 | Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier | Electricity | 6 | Active |
| US8905794B2 | Connector assembly and method | Electricity | 6 | Active |
| US9685413B1 | Semiconductor package having an EMI shielding layer | Electricity | 6 | Active |
| US10056182B2 | Surface-mount inductor structures for forming one or more inductors with substrate traces | Emerging Cross-Sectional Technologies | 5 | Active |
| US9385457B2 | Connector assembly and method | Electricity | 4 | Active |
| US9491881B2 | Microelectronic socket comprising a substrate and an insulative insert mated with openings in the substrate | Emerging Cross-Sectional Technologies | 3 | Active |
| US9635764B2 | Integrated circuit and method that utilize a shape memory material | Electricity | 3 | Active |
| US9178328B2 | Shielded sockets for microprocessors and fabrication thereof by overmolding and plating | Electricity | 3 | Active |
| US9172160B2 | Vertical socket contact with flat force response | Emerging Cross-Sectional Technologies | 2 | Active |
| US8961193B2 | Chip socket including a circular contact pattern | Emerging Cross-Sectional Technologies | 2 | Active |
| US10707171B2 | Ultra small molded module integrated with die by module-on-wafer assembly | Electricity | 2 | Active |
| US9991211B2 | Semiconductor package having an EMI shielding layer | Electricity | 2 | Active |
| US9780510B2 | Socket contact techniques and configurations | Electricity | 2 | Active |
| US9615483B2 | Techniques and configurations associated with a package load assembly | Electricity | 2 | Active |
| US11135494B2 | Training aid support base and assembly | Human Necessities | 2 | Active |
| US9385444B2 | Lateral slide pick and place cover for reduced bent pins in LGA sockets | Emerging Cross-Sectional Technologies | 2 | Active |
| US10224290B2 | Electromagnetically shielded electronic devices and related systems and methods | Electricity | 1 | Active |
| US9603276B2 | Electronic assembly that includes a plurality of electronic packages | Electricity | 1 | Active |
| US10205292B2 | Socket contact techniques and configurations | Electricity | 1 | Active |
| US10193493B2 | Multi-surface solar cell packaging for self-powered electronic devices | Emerging Cross-Sectional Technologies | 1 | Active |
| US9728425B1 | Space-efficient underfilling techniques for electronic assemblies | Electricity | 1 | Active |
| US9325087B2 | Electronic assemblies with scalable clip-type connectors | Emerging Cross-Sectional Technologies | 1 | Active |
| US9824901B2 | Complex cavity formation in molded packaging structures | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.