MEMS devices on flexible substrate
US10207916B2 · kind B2 · utility
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22References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 11, 2015 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Jun 5, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2207/053
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A flexible film including one or more MEMS elements and articles including the flexible film are described. The flexible film includes a polymer layer between two metal layers with one of the metal layers containing a perforation. The polymer layer includes voided regions that allow for relative movement of the two metal layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.