John D. Geissinger
11Patents
3h-index
19Co-inventors
57Inventor score
Filing activity: Dec 2, 1996 → Sep 6, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5844168A | Multi-layer interconnect sutructure for ball grid arrays | Electricity | 148 | Expired |
| US5990545A | Chip scale ball grid array for integrated circuit package | Electricity | 124 | Expired |
| US7064412B2 | Electronic package with integrated capacitor | Electricity | 50 | Expired |
| US11164063B2 | Multilayer stack including RFID tag | Physics | 0 | Active |
| US10628727B2 | RFID tag on stretchable substrate | Human Necessities | 0 | Active |
| US10740669B2 | Film assembly and multilayer stack including antenna | Physics | 0 | Active |
| US10496915B2 | RFID tag on flexible substrate | Physics | 0 | Active |
| US7388275B2 | Electronic package with integrated capacitor | Electricity | 0 | Active |
| US12376272B2 | Cable assembly with crosstalk barrier | Electricity | 0 | Active |
| US10207916B2 | MEMS devices on flexible substrate | Performing Operations; Transporting | 0 | Active |
| US10229353B2 | RFID tag on stretchable substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.