Epoxy resin composition, prepreg and laminate using same
US10208156B2 · kind B2 · utility
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2References
22Claims
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Key dates
| Filing date | Jun 1, 2015 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Oct 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0212
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided in the present invention are an epoxy resin composition, prepreg and laminate using the same, the epoxy resin composition comprising the following components: (A) an imide modified epoxy resin; and (B) a crosslinking agent, the imide modified epoxy resin being an epoxy resin having a structure of formula (1) and/or formula (2). The prepreg and laminate prepared from the epoxy resin composition have a high glass-transition temperature, a low dielectric constant, a low dielectric loss factor, a high heat and humidity resistance, a high toughness and a good processability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.