Direct printed circuit routing to stacked opto-electrical IC packages
US10209464B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2014 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Mar 3, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1053
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical transmitter may include a chip stack that includes an electrical IC that is mounted using solder balls to a photonic chip. These solder connections permit the electrical IC and the photonic chip to communicate. In addition, the transmitter may include a PCB coupled to the stack so that electrical signals in the PCB are transmitted to the IC and photonic chip (and vice versa). Instead of coupling the PCB to the stack using wire bonds attached to pads on a surface of the photonic chip, at least a portion of the PCB is disposed between the photonic chip and electrical IC. The PCB may also include bond pads used to form a direct solder connection to the electrical IC. As such, the electrical IC may include direct solder connections to both the PCB and the photonic chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.