Inventor · Bound Brook, NJ, US

Bipin Dama

22Patents
7h-index
25Co-inventors
65Inventor score

Filing activity: Jun 22, 2005 → Jun 12, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US7483597B2 Optical modulator utilizing multi-level signaling Electricity 26 Active
US10209464B2 Direct printed circuit routing to stacked opto-electrical IC packages Electricity 15 Active
US7269809B2 Integrated approach for design, simulation and verification of monolithic, silicon-based opto-electronic circuits Physics 15 Expired
US8803269B2 Wafer scale packaging platform for transceivers Electricity 14 Active
US8905632B2 Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components Electricity 10 Active
US7570889B2 Common electronic dispersion compensation arrangement for use with multiple optical communication channels Electricity 8 Active
US8340529B2 HDMI TMDS optical signal transmission using PAM technique Physics 7 Active
US9235019B2 Self-aligning optical connector assembly Emerging Cross-Sectional Technologies 6 Active
US8929689B2 Optical modulator utilizing unary encoding and auxiliary modulator section for load balancing Physics 6 Active
US8364042B2 Optical interconnection arrangement for high speed, high density communication systems Electricity 4 Active
US8876410B2 Self-aligning connectorized fiber array assembly Emerging Cross-Sectional Technologies 3 Active
US9031107B2 Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components Electricity 3 Active
US10725254B2 High density opto-electronic interconnection configuration utilizing passive alignment Electricity 3 Active
US8724939B2 Enhanced low inductance interconnections between electronic and opto-electronic integrated circuits Electricity 2 Active
US9343450B2 Wafer scale packaging platform for transceivers Electricity 2 Active
US9435965B2 Single mode fiber array connector for opto-electronic transceivers Physics 1 Active
US11611738B2 User interface module for converting a standard 2D display device into an interactive 3D display device Electricity 0 Active
US9575266B2 Molded glass lid for wafer level packaging of opto-electronic assemblies Electricity 0 Active
US11886013B2 Passively-aligned fiber array to waveguide configuration Physics 0 Active
US9052445B2 Molded glass lid for wafer level packaging of opto-electronic assemblies Electricity 0 Active
US9793902B2 Reference-less clock and data recovery circuit Electricity 0 Active
US9209509B2 Enhanced low inductance interconnections between electronic and opto-electronic integrated circuits Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.