Signal response metrology for image based and scatterometry overlay measurements
US10210606B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2015 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Jan 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/56
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and systems for measuring overlay error between structures formed on a substrate by successive lithographic processes are presented herein. Two overlay targets, each having programmed offsets in opposite directions are employed to perform an overlay measurement. Overlay error is measured based on zero order scatterometry signals and scatterometry data is collected from each target at two different azimuth angles. In addition, methods and systems for creating an image-based measurement model based on measured, image-based training data are presented. The trained, image-based measurement model is then used to calculate values of one or more parameters of interest directly from measured image data collected from other wafers. The methods and systems for image based measurement described herein are applicable to both metrology and inspection applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.