Rework grid array interposer with direct power
US10211120B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2015 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Feb 16, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/176
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A rework grid array interposer with direct power is described. The interposer has a foundation layer mountable between a motherboard and a package. A heater is embedded in the foundation layer to provide local heat to reflow solder to enable at least one of attachment or detachment of the package. A connector is mounted on the foundation layer and coupled to the heater and to the package to provide a connection path directly with the power supply and not via the motherboard. One type of interposer interfaces with a package having a solderable extension. Another interposer has a plurality of heater zones embedded in the foundation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.